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TVS Diode Arrays (SPA ? Family of Products)
Lightning Surge Protection - SP4062 Series
Capacitance vs. Bias
Ordering Information
5 .0
Part Number
SP4062-04UTG
Package
μDFN-10
Marking
UH4
Min. Order Qty.
3000
4.0
3.0
2.0
1.0
0.0
0.0
0. 5
1.0
1. 5
2.0
2. 5
3.0
Bias Voltage (V)
Soldering Parameters
Re?ow Condition
- Temperature Min (T s(min) )
Pb – Free assembly
150°C
T P
Ramp-up
t P
Critical Zone
T L to T P
Pre Heat
- Temperature Max (T s(max) )
- Time (min to max) (t s )
200°C
60 – 180 secs
T L
T S(max)
t L
Ramp-down
Average ramp up rate (Liquidus) Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
3°C/second max
3°C/second max
T S(min)
t S
Preheat
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
25
time to peak temperature
Time
Peak Temperature (T P )
260 +0/-5 °C
Time within 5°C of actual peak
Temperature (t p )
Ramp-down Rate
Time 25°C to peak Temperature (T P )
20 – 40 seconds
6°C/second max
8 minutes Max.
Part Numbering System
SP 4062 - 04 U T G
Do not exceed
Product Characteristics
Lead Plating
Lead Material
Lead Coplanarity
Substitute Material
Body Material
Flammability
260°C
Pre-Plated Frame
Copper Alloy
0.0004 inches (0.102mm)
Silicon
Molded Epoxy
UL 94 V-0
Silicon Protection
Array (SPA TM )
Family of
TVS Diode Arrays
Series
Number of
Channels
Part Marking System
U * 4
Product Series
U = SP4062
G= Green
T= Tape & Reel
Package
U= μDFN-10
Number of
Channels
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold ?ash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte ?nishVDI 11-13.
Assembly Site
?2011 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
167
Revision: March 20, 2012
SP4062 Series
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